BAE SYSTEMS INFORMATION & ELECTRONIC SYSTEMS INTEGRATION INC
Department of Defense · Contract
AI-Readiness Score
2/19
AI / ML Relevance
0/9
Problem Framing
2/5
Awardee Quality
0/5
Award
$6,671,089
Award amount
—
Award date
FA238524CB005
PIID
Awardee
30
Total awards
$1,764,990,334
Total $ won
2.8/19
Avg AI score
Description
NITRIDE ELECTRONICS WITH ENHANCED DEVICE LEVEL HEAT EXTRACTION (NEEDLE)
Score Rationale
This award funds advanced semiconductor materials and thermal engineering (GaN/nitride electronics), with zero mention of AI/ML techniques, models, or autonomous systems — the description is purely about device-level heat extraction physics. Problem framing is minimal: 'NEEDLE' is a materials acronym with no articulated operational problem or end-user scenario beyond implicit thermal performance improvement. BAE Systems Information & Electronic Systems Integration is a large legacy defense prime (subsidiary of BAE Systems plc), not an AI-native company.